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3rd Gen EPYC™ With AMD 3D V-Cache
3rd Gen EPYC™ processors – already the world’s highest-performing for general-purpose computing – are now reaching new heights for technical computing. Introducing AMD 3D V-Cache, the first x86 CPU technology with true 3D die stacking.
DISCOVER 3D V-CACHE
- 3X the L3 cache for breakthrough per-core performance
- Socket compatibility with existing 3rd Gen EPYC™ platforms
- Advanced security features
AMD Instinct™ MI200 Series Accelerators
Introducing the world’s fastest HPC and AI accelerators, designed to power scientific discoveries in exascale systems.1
- Based on AMD CDNA™ 2 architecture, purpose-built for HPC and AI training workloads
- Multi-die GPU maximizes compute and memory throughput
- Intelligent interconnect enables higher performance and CPU-GPU coherency for simplified programming
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Watch AMD Accelerated Data Center event featuring Instinct MI250X HPC GPU here - VideoCardz.com
AMD CEO Lisa Su presents next-generation high-performance CPUs and GPUs for data centers Watch a premier of the AMD Accelerated Data Center event. AMD (NASDAQ: AMD) will host its Accelerated Data Center Premiere on November 8, 2021 at 11 a.m. ET, showcasing the company’s upcoming innovations...
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