• Hey, guest user. Hope you're enjoying NeoGAF! Have you considered registering for an account? Come join us and add your take to the daily discourse.

AMD Ryzen Zen 5 XD releases November 7th

Draugoth

Gold Member
ryzenx3d9000series.png

AMD is officially announcing its first next-generation X3D desktop processors today, based on its latest Zen 5 architecture.

Thanks to other leaks, we’re expecting to hear more about the 9800X3D soon, which will likely be the first next-gen X3D processor to launch on November 7th, with eight cores. Rumors suggest it will include a 4.7GHz base clock, with a boost clock of 5.2GHz or higher.

Reviews

AMD Ryzen 9000 now cheaper​

AMD is also announcing a price cut for the Ryzen 9000X non-3D series. Early adopters may be disappointed to hear that the Zen 5 desktop CPUs are now $30 to $50 cheaper than they were two months ago. The official price cuts are as follows:

AMD Ryzen 9000 Deals (affiliate links)​

 
Last edited:

CJ_75

Member
Will this have any benefit over the Ryzen 9 7900X in a 4090 gaming rig playing in 4K? It wasn’t for the 7800X3D.
 

GHG

Gold Member
Also 9950X + 3090
faa3fb795a987aeca606afced15af4ba.png



14900 + 4090 + 8400С36
edf747911ffb8edb53da591414b0a3e4.png

Those are run at different resolutions to the 9800x3d benchmark though.

I'm not familiar with this benchmark, does the resolution affect the final number being presented?
 

Celcius

°Temp. member

They're also dropping the price on zen 5 non-X3D
I'm definitely waiting for reviews on the 9800X3D before deciding how to upgrade this fall...
 

dave_d

Member
I'm not familiar with this benchmark, does the resolution affect the final number being presented?
I think the deal is that you use a lower resolution so the speed of the video card won't affect the result. (Pretty much any cpu specific benchmark I've seen they run at lower resolutions because of that. That is opposed to say full 4k where most of the work is being done by the video card.)
 

GHG

Gold Member
I think the deal is that you use a lower resolution so the speed of the video card won't affect the result. (Pretty much any cpu specific benchmark I've seen they run at lower resolutions because of that. That is opposed to say full 4k where most of the work is being done by the video card.)

I know that, it's the benchmark result number that it's spitting out that I'm questioning.

Some benchmarks posted in this thread are 720p whereas others are 1080p.
 

ap_puff

Member
Remastered. REIMAGINED


There is answer in posts

maybe I'm reading into it too much but does that triple layer profile on the X3D design lend some credibility to the double-stacked 3d vcache theory that High Yield had? Also seeing some leaked prices showing it's gonna be $50 more expensive than the 7800X3D launch. If it's got more expensive packaging that would make sense
 
Last edited:

ap_puff

Member
Seems so here is answer also
5ff281905b840e7bcb9fe9a6f1963448.png
Oh interesting, so instead of doing the cache die on top, they're going to do it on the bottom? I guess if that means you get the compute area closer to the IHS that would help with heat dissipation. But what about voltages? I thought one of the reasons why 3dcache was clocked lower was lower voltage tolerances, but if you're doing the cache on the bottom then wouldn't it be exposed to higher voltage?
 

SolidQ

Gold Member
But what about voltages? I thought one of the reasons why 3dcache was clocked lower was lower voltage tolerances, but if you're doing the cache on the bottom then wouldn't it be exposed to higher voltage?
Need wait to see how it's going. More leaks soon coming or two weeks from release. Also waiting Deep Dive from Chips and Cheese
 

b0uncyfr0

Member
Hmm definitely skipping this one. My 5800x3d will hold out.

But do we have any news on DDR6? Knowing AMD, testing and first adopters will suffer as per usual. Maybe AM6 will have it.
 

Schnauzer

Member
Sounds like this will be a 2-3% performance increase. If they had something worth showing, they would have played their cards before the Intel release not afterwards.
 

marquimvfs

Member
Oh interesting, so instead of doing the cache die on top, they're going to do it on the bottom? I guess if that means you get the compute area closer to the IHS that would help with heat dissipation. But what about voltages? I thought one of the reasons why 3dcache was clocked lower was lower voltage tolerances, but if you're doing the cache on the bottom then wouldn't it be exposed to higher voltage?
That's not how it works, voltage are provided by Motherboard's VRM at a stable level, it won’t get significantly higher or lower if you place things differently. But being under the cores die could force the clocks to be even lower to keep it's temperature in check.
 

ap_puff

Member
That's not how it works, voltage are provided by Motherboard's VRM at a stable level, it won’t get significantly higher or lower if you place things differently. But being under the cores die could force the clocks to be even lower to keep it's temperature in check.
No, voltage drops as you run current through resistors. Cache being on top of the compute die means that it will be exposed to lower voltage as the current has to go from the VRM->traces->TSVs/compute die->cache. Maybe it's only a few mv but it makes a difference when the 3d cache is voltage sensitive to begin with. Btw the cache is drawing much less power than the CPU cores (hence cooler), and having the cache chiplet underneath actually improves cooling as right now the cache chiplet only covers the L3 of the base chip + a small portion of the cores+L2 cache, with the "empty space" filled with structural silicon. Moving the core chiplet up top would actually give a signifcant improvement in cooling as now it has greater direct surface area contact with the IHS/interposer.
 

marquimvfs

Member
Moving the core chiplet up top would actually give a signifcant improvement in cooling as now it has greater direct surface area contact with the IHS/interposer.
No, voltage drops as you run current through resistors.
Cache being on top of the compute die means that it will be exposed to lower voltage as the current has to go from the VRM->traces->TSVs/compute die->cache.
having the cache chiplet underneath actually improves cooling
well, maybe I'm in the wrong here, but didn't the interposer feed both the CPU and cache in parallel? The top chiplet still had direct connection with the interposer, no? If I'm right, the conductor distance wasn't long enough to cause any significant resistance, decreasing it's size shouldn't increase the voltage at a significant level.

Also, I get that moving cores die would greatly improve general heat dissipation, but, and again, I might be wrong here, as much as cache got heat from cores above in the old design, being in direct contact with the ihs maked it's dissipation better than if being below. Now, being under cores, as much as there's no heat from below, the cache dissipation is worse than before. What I don't know is that with less heat from below, but also more heat fr above and less dissipation capabilities, if the cache will, in fact, be cooler. If I'm not mistaken, it will be hotter.
 
Last edited:

Celcius

°Temp. member
Here's what I get with my 10700k + rtx 3090 at 1080p lowest settings:

EzG2Nqn.jpeg


This cpu upgrade is going to be huge for me. Folks with the same videocard & settings but newer cpus are getting literally double the score so I'm being held back big time.
 
Last edited:

DonkeyPunchJr

World’s Biggest Weeb
8% faster at gaming vs 7800X3D. Wonder what resolution that’s at. Seems like a pretty small generational improvement compared to the 5800X3D -> 7800X3D improvement.

 
Top Bottom