5700XT is 251mm2 Zen2 75 mm2 add an extra 10 mm2 for RT
Total: 336mm2 on plain 7nm
7nm EUV its a 20% reduction->336*0.8 = 268.8 mm2
That's a very rough estimate, console chips are more optimized and waste less space
Your "prediction" doesnt fit 7nm euv
A 7nm 400mm2 die would be 320mm2 on 7nm EUV
Okay, while this sounds good but I think a couple things should be considered first.
#1. I believe that MS and Sony both have final silicon. So even if the 7nm EUV process is being used, it's not going to change what is already on the die. The process is worth waiting for as it's both cost effective and increases performance.
#2 MS has already shown an approximation of their APU in their Project Scarlett announcement, and it has been estimated to be 380mm2 - 400mm2.
I don't believe MS' APU is getting any smaller. I believe that the Scarlett APU we saw in that announcement is POST 7nm EUV, not a chip waiting for any further reductions. Otherwise MS would not have revealed it that way to us. So MS' APU is going to be large regardless, as it makes sense as they are claiming accelerated RT right out of the gate.
So I would exercise a bit of caution before being convinced that the 7nm EUV process will bring additions to what may already be final silicon.
Don't mean to sound like a killjoy but tempering our expectations is still probably the best way forward. At least until MS and Sony reveal otherwise.
