Apollo Helios
Member
Let me start with the link.
Vapor chamber confirmed.
Abstract
An electronic device (10) has a plurality of cooling fans (15) for supplying air to a heat sink (30). The plurality of cooling fans (15) create air flows (Fh) that pass through the heat sink (30) from a first side (H1) of the heat sink (30) toward a second side (H2) of the heat sink (30). The heat sink (30) is disposed oblique to the left-right direction and the front-rear direction of the electronic device (10). An exterior member (40) has an intake port (41i) formed along the first side (H1) of the heat sink (30) and oblique to the front-rear direction and the left-right direction.
Most interesting image is this
As shown in FIG. 6, the electronic device 10 has a heat sink 30. The heat sink 30 is connected to the integrated circuit 11a (see FIG. 6) which is a heat source mounted on the circuit board 11 and receives heat from the integrated circuit 11a. The electronic device 10 has a plurality of cooling fans 15 (see FIG. 6 ), and the heat sink 30 is cooled by receiving the air flow formed by the cooling fans 15. The heat sink 30 is one of the cooling target components described in the claims.
In the example shown by the electronic device 10, the heat sink 30 is arranged above the circuit board 11. As shown in FIG. 6, the heat sink 30 has a plate-shaped bottom portion 31 and a plurality of fins 32 formed on the bottom portion 31. The bottom 31 is in contact with the integrated circuit 11a. The heat of the integrated circuit 11a is transferred from the bottom portion 31 to the fin 32. The shield 12 may have an opening for exposing the integrated circuit 11a so as to allow contact between the integrated circuit 11a and the heat sink 30.
The bottom 31 is, for example, a vapor chamber. That is, the bottom portion 31 is, for example, a metal plate having a space in which a liquid that easily vaporizes is enclosed. The bottom portion 31 may be a metal plate (metal block) having no such space. The fins 32 are welded to the bottom portion 31 and are arranged in the direction along the circuit board 11.
So from what I gather downside of the motherboard is also connected to the heatsink. Interesting images in there.
Vapor chamber confirmed.
Abstract
An electronic device (10) has a plurality of cooling fans (15) for supplying air to a heat sink (30). The plurality of cooling fans (15) create air flows (Fh) that pass through the heat sink (30) from a first side (H1) of the heat sink (30) toward a second side (H2) of the heat sink (30). The heat sink (30) is disposed oblique to the left-right direction and the front-rear direction of the electronic device (10). An exterior member (40) has an intake port (41i) formed along the first side (H1) of the heat sink (30) and oblique to the front-rear direction and the left-right direction.
Most interesting image is this
As shown in FIG. 6, the electronic device 10 has a heat sink 30. The heat sink 30 is connected to the integrated circuit 11a (see FIG. 6) which is a heat source mounted on the circuit board 11 and receives heat from the integrated circuit 11a. The electronic device 10 has a plurality of cooling fans 15 (see FIG. 6 ), and the heat sink 30 is cooled by receiving the air flow formed by the cooling fans 15. The heat sink 30 is one of the cooling target components described in the claims.
In the example shown by the electronic device 10, the heat sink 30 is arranged above the circuit board 11. As shown in FIG. 6, the heat sink 30 has a plate-shaped bottom portion 31 and a plurality of fins 32 formed on the bottom portion 31. The bottom 31 is in contact with the integrated circuit 11a. The heat of the integrated circuit 11a is transferred from the bottom portion 31 to the fin 32. The shield 12 may have an opening for exposing the integrated circuit 11a so as to allow contact between the integrated circuit 11a and the heat sink 30.
The bottom 31 is, for example, a vapor chamber. That is, the bottom portion 31 is, for example, a metal plate having a space in which a liquid that easily vaporizes is enclosed. The bottom portion 31 may be a metal plate (metal block) having no such space. The fins 32 are welded to the bottom portion 31 and are arranged in the direction along the circuit board 11.
So from what I gather downside of the motherboard is also connected to the heatsink. Interesting images in there.
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