Well this is starting to go over my head as I didn't come anywhere near finishing school for this and my job path took me further away.
But considering what was said about using eDRAM in that regard the last part of your first paragraph comes off as being highly exaggerated. Not saying it's wrong, just compared to what I've read that's how it sounds.
Also I didn't say it wasn't shared. I said there were no indications of it being shared. I'm very familiar with how it works in the POWER7 chip.
The last part is just us going in a circle on the same thing. You said that amount would be disappointing due to the eDRAM's density, I said I can see it being used to keep the die size down. I think this makes either three or four times now.