Agnostic2020
Member
Its a very long interview with harware vp of mechanical and thermal for ps5 :
He goes into detail as to why he started developing the liquid metal application method research for ps5 more than 2 years ago .
"I really wanted to use liquid metal as a heat conductor. It took a lot of determination and preparation. Sony Interactive Entertainment's (SIE) PlayStation 5 (PS5) console is scheduled to launch in November 2020, and Yasuhiro Otori, who is responsible for the mechanical and thermal design of the console, has been working on the PS5 This is how he describes his thoughts on the technology that played a key role in making the He has been involved in the design of the PlayStation since the PS2, and appeared himself in the PS5 disassembly video released by SIE on October 7, 2020, to work and explain the process.
Why did we liquid metal in TIM?
Preparations for the adoption of liquid metal TIM began more than two years ago, when the configuration and shape of the PS5 hardware was roughly decided. In addition to the design, we began to consider various aspects of the adoption of liquid metal TIM, from the manufacturing process to procurement. They decided to use liquid metal TIM because the main processor (SoC) had a high operating frequency, but the die was small and the thermal density was "very high" (Mr. Otori). The heat density of the SoC, especially during gaming, is "much higher" (he said) than the PS4. That's because the PS5's SoC "basically runs at almost full power during gaming" (he says). As a result, TDP (Thermal Design Power) values and the amount of heat generated during gaming are "about the same". On the other hand, it is rare for a PS4 SoC to operate at the very edge of TDP, and even when gaming, it generates only a few percent of its TDP.
The reason for the small size of the SoC die is that die size is directly related to cost and yield. In other words, the smaller the die size, the lower the cost and the more difficult it is for defects to enter the die, which leads to higher yields.
Liquid metal TIM is more expensive than conventional thermal conductors such as thermal grease. However, when considering the thermal design of electronic devices, the more effort is put into cooling close to the heat source, the "better the cost performance" (Mr. Otori). This is because if heat can be recovered efficiently near the heat source, there is no need to spend money on heat sinks and cooling fans. On the other hand, if thermal grease is used, an expensive heat sink with high cooling performance is required.
In other words, even if we use liquid metal TIM, which leads to higher costs, we can reduce the total cost of cooling as a result," says Otori. The speed of the cooling fan can also be reduced, which reduces noise. In other words, the use of liquid metal TIM "makes sense in terms of cost and quietness" (Mr. Otori).
although TIM is used in mobile phone base stations and other devices, its use in consumer applications is limited to a limited number of notebook computers and "overclockers," which are enthusiasts who increase the operating frequency of processors. .
Therefore, the company has taken measures to address these issues so that it can be used in game consoles that are mass-produced in quantities ranging from several million units to more than 10 million units per year. For example, a sealed structure was adopted to prevent leakage of the liquid metal TIM. This structure is patented, although it would be obvious if it were to be disassembled and seen. Above all, there is a lot of manufacturing know-how, such as how to apply and automate liquid metal TIM, that is not obvious just by looking at it," said Otori. For example, liquid metal TIM is applied by an automated machine, but "it's a different method than conventional grease," according to Mr. Otori. We cooperated with material manufacturers to realize this liquid metal TIM. The company claims to have added customizations based on existing products.
Full article:
xtech.nikkei.com
Translated with www.DeepL.com/Translator (free version)
He goes into detail as to why he started developing the liquid metal application method research for ps5 more than 2 years ago .
"I really wanted to use liquid metal as a heat conductor. It took a lot of determination and preparation. Sony Interactive Entertainment's (SIE) PlayStation 5 (PS5) console is scheduled to launch in November 2020, and Yasuhiro Otori, who is responsible for the mechanical and thermal design of the console, has been working on the PS5 This is how he describes his thoughts on the technology that played a key role in making the He has been involved in the design of the PlayStation since the PS2, and appeared himself in the PS5 disassembly video released by SIE on October 7, 2020, to work and explain the process.
Why did we liquid metal in TIM?
Preparations for the adoption of liquid metal TIM began more than two years ago, when the configuration and shape of the PS5 hardware was roughly decided. In addition to the design, we began to consider various aspects of the adoption of liquid metal TIM, from the manufacturing process to procurement. They decided to use liquid metal TIM because the main processor (SoC) had a high operating frequency, but the die was small and the thermal density was "very high" (Mr. Otori). The heat density of the SoC, especially during gaming, is "much higher" (he said) than the PS4. That's because the PS5's SoC "basically runs at almost full power during gaming" (he says). As a result, TDP (Thermal Design Power) values and the amount of heat generated during gaming are "about the same". On the other hand, it is rare for a PS4 SoC to operate at the very edge of TDP, and even when gaming, it generates only a few percent of its TDP.
The reason for the small size of the SoC die is that die size is directly related to cost and yield. In other words, the smaller the die size, the lower the cost and the more difficult it is for defects to enter the die, which leads to higher yields.
Liquid metal TIM is more expensive than conventional thermal conductors such as thermal grease. However, when considering the thermal design of electronic devices, the more effort is put into cooling close to the heat source, the "better the cost performance" (Mr. Otori). This is because if heat can be recovered efficiently near the heat source, there is no need to spend money on heat sinks and cooling fans. On the other hand, if thermal grease is used, an expensive heat sink with high cooling performance is required.
In other words, even if we use liquid metal TIM, which leads to higher costs, we can reduce the total cost of cooling as a result," says Otori. The speed of the cooling fan can also be reduced, which reduces noise. In other words, the use of liquid metal TIM "makes sense in terms of cost and quietness" (Mr. Otori).
although TIM is used in mobile phone base stations and other devices, its use in consumer applications is limited to a limited number of notebook computers and "overclockers," which are enthusiasts who increase the operating frequency of processors. .
Therefore, the company has taken measures to address these issues so that it can be used in game consoles that are mass-produced in quantities ranging from several million units to more than 10 million units per year. For example, a sealed structure was adopted to prevent leakage of the liquid metal TIM. This structure is patented, although it would be obvious if it were to be disassembled and seen. Above all, there is a lot of manufacturing know-how, such as how to apply and automate liquid metal TIM, that is not obvious just by looking at it," said Otori. For example, liquid metal TIM is applied by an automated machine, but "it's a different method than conventional grease," according to Mr. Otori. We cooperated with material manufacturers to realize this liquid metal TIM. The company claims to have added customizations based on existing products.
Full article:
PS5に覚悟の「液体金属」採用、真の狙いはコスト削減
「液体金属（による熱伝導材）をどうしても使いたかった。それには相当な決意と準備が必要だった」――。米Sony Interactive Entertainment（SIE、ソニー・インタラクティブエンタテインメント）が2020年11月に発売予定の据え置き型ゲーム機「PlayStation 5（PS5）」の機構設計・熱設計の責任者である鳳（おおとり） 康宏氏は、PS5を実現する上で重要な役割を担った技術への思いをこう語る。同氏は、PS2からプレイステーションの設計に携わっており、SIEが2020年10月7日に公開したPS5の分解動画では、自ら出演し、作業と解説を行った。
Translated with www.DeepL.com/Translator (free version)
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