Intel Nova Lake-S Desktop CPU SKUs Leak: Up To 52 Cores With 16 P-Cores, 32 E-Cores & 150W TDP, Entry-Level SKUs With 12 Cores

In higher core count workloads the u9 and r9 are neck and neck.
If you are buying high core count CPUs and NEED them then Intel is totally viable.
Down the stack the 12/3/400 were always good and I dont believe Intel ever brought out the replacement 240 or atleast havent seen any in the wild.
Cinebench 2025 doesn't use vector 256-bit or vector 512-bit. It's exploits scalar 3-operands floating point from AVX2. Cinebench 2025 has the old scalar 3 operands from the old school RISC workstation world.
 
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Man, this just seems to be Windows Scheduling nightmare. You just know first 6 months to a year lost release it will run terribly with games without manually turning off E cores or using stuff like lasso.
 
Are you sure this is the correct way to go.. i doubt it

Arm has no such concept
What? Literally modern arm cores including Apple (apples A15 cpu has 2 P cores and 4 E cores), arms own and even Qualcomms are heterogenous with different types of cores in the same cpu. Hell this trend started with ARM, if anything x86 is late to the party. The 11 year old Qualcomm SD 808 had two
Cortex-A57 cores and 4 Cortex-A53 cores.

Nvidia's new GB10 CPU used in their upcoming laptops has ten Cortex-X925 cores (P cores), ten Cortex-X725 cores (E cores).
 
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It wasn't only ASRock happened on Asus and others as well but ASRock was the worst by far.

For context,

"There currently have been around 100 reported cases on Reddit of 9000 series x3D failures."
From https://www.tomshardware.com/pc-com...ority-may-be-happening-on-asrock-motherboards

"Moderator SoupaSoka on the ASRock subreddit created a "9800X3D Failures/Deaths" megathread revealing an allegedly high amount of user reports surrounding dying 9800X3Ds on ASRock motherboards. Over 40 reports have been made so far, with 32 of them on ASRock's boards."

Total found now potentially 157 dead 9800X3Ds, 130 on ASRock boards, 20 ASUS, 5 MSI, 2 Gigabyte.

Case with multiple dead 9800X3Ds on the same mobo: 23 and 143.

Dead 9800X3D tally based on chipset:

  • B650: 23 cases
  • B850: 56 cases
  • X670: 9 cases
  • X870: 68 cases
  • A620: 1 case
Also 16 other 9000 series CPU, 15 ASRock boards, 1 Gigabyte.

Also 8 cases for the 9950X3D, 1 ASUS, 7 ASRock, 7 on X870 chipset and 1 on B650.


There are millions of AM5 motherboards and CPUs. ASRock's result is abnormal since they are FAR above other brands' failure incident reports.
 
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So 500W then?
It's a typo... 1,500 W on load.
 
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Ok if 2nm then AMDs next chip is rumoured to be the same, with 12 cores on 1 CCD.
AMD already has 16 cores Zen 5c "Turin Dense" CCX with shared L3 cache.

Zen 5c "Turin Dense" has the full 512-bit AVX hardware implementation, which is different from Strix Point's Zen 5c.
 

The Core Ultra 200 series ended up being around 5% slower than the previous generation in gaming benchmarks. Nova Lake, expected to launch next year for both desktops and laptops, is rumored to deliver at least a 10% uplift in single-threaded performance (overall, not just gaming). A slide shared on X shows Intel targeting a 1.1x gain in single-threaded and 1.6x in multi-threaded performance, presumably compared to the Core Ultra 200 series.

The slide doesn't confirm which product segment this refers to. It could be a mobile chip, or a non-flagship configuration, for all we know. What's clear, though, is that Intel is once again focusing on gaming performance, something that wasn't highlighted during Arrow Lake's rollout. The slide even mentions "leadership in gaming performance," which implies a potential performance edge over AMD's Ryzen 9000X3D series, that would be a notable shift if true.

INTEL-NOVA-LAKE-IPC.png
 

According to tipster @Haze2K1, at least two SKUs in the Nova Lake lineup will ship with increased L3 cache. Intel calls the new technology "bLLC," which is short for "big Last Line Cache." The leaker added that both SKUs with bLLC will feature 8 P-cores and 4 LP-E cores. One will be paired with 20 E-cores, while the other will include only 12. Both chips are expected to have a 125W TDP.
 
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