Since Sony is about to reveal more details on PS5 tomorrow, I though it would be fun to look back at my two favorite PS5 rumors from the past few years. NOTE: These are my favorite rumors NOT BECAUSE THEY ARE CORRECT, but rather they are both technically elegant. They show deep technical thinking beyond the normal FAKE rumor posted on Pastebin, Reddit, Twitter, etc.
First fun Technical Rumor:
Was posted on Pastebin Jun 28, 2019:
https://pastebin.com/D9av648X
Ps5
12+tflop
8gb hmb2+16gb ddr4
Custom nitero silicon
1tb nand
This one is fun, because this is the only rumor I have seen that mentioned custom Nitero silicon. Forget the 12 TF and HBM2 parts, that is not new thinking and any random person could make it up. But what very few people could come up with is "custom Nitero silicon". First, you need to understand who or what Nitero is. Then you need to understand why it might be useful for Sony to have it in a PS5. If you are curious, do some Googling for details. But the short answer is that Nitero was designing a 60GHz wireless solution that could be used for VR and was acquired by AMD in Apr. of 2017. If you are Sony working on a PSVR2, wouldn't you want a wireless solution? Pastebin rumors are 99.99% fake, but at least this one is thoughtful on a technical level.
Second fun Technical Rumor:
This one was posted on Reddit in Apr. 2019. I can no longer find a link, but I'll post the details.
PS5 memory and storage systems
- 24 GB RAM in total (20 GB usable by games)
- 8 GB in form of 2 * 4-Hi stacks HBM2
- Sony got "amazing" deal for HBM
- in part due to them buying up bad chips from other customers which can't run higher then 1.6 Gbps while keeping 1.2v.
- HBM is expected to scale down in price a lot more than GDDR6 over the console lifetime
- Samsung, Micron and SK Hynix already shifting part of their capacity towards HBM due to falling NAND prices
- Sony will be one of the first high volume customers of TSMCs InFO_MS when mass production starts later this year (normal InFo already used by Apple in their iPhone)
- InFO_MS brings down the cost compared to traditional silicon interposers - has thermal and performance advantage as well
- InFO_MS allows them to drive their 1.6 Gbps chips @ 1.7 Gbps (435 GB/sec.) without having to increase the voltage above 1.2v
- HBM is more power efficient compared to GDDR6 - the savings were invested into more GPU power
- additional 16 GB in form of DDR4 @ 256 bit for 102.4 GB/sec.
- 4 GB reserved for OS, the remaining 12 GB usable by games
- memory automatically managed by HBCC and appears as 20 GB to the developers
- HBCC manages streaming of game data from storage as well
- developers can use the API to take control if they choose and manage the memory and storage streaming themselves
- memory solution alleviates problems found in PS4
- namely that CPU bandwidth reduces GPU bandwidth disproportionately
- 2 stacks of HBM have 512 banks (more banks = fewer conflicts and higher utilization)
- GDDR6 better than GDDR5 and GDDR5x in that regard but still less banks than HBM
- at the same time trying to keep CPU memory access to slower DDR4
- very satisfied with decision to use two kinds of memory for price to performance reasons
- allowed them to go below ~50 GFLOPs per GB/sec. bandwidth but still keep above 40 GFLOPs per GB/sec.
I love this rumor, because someone technical wrote this rumor. Most fake rumors are made by fan boys who don't understand engineering and have almost every technical detail wrong, but this one is actually technically plausible. Forget that it sounds improbable from a cost point of view. Instead, go through it line by line and ask yourself if each line is technically correct. If it's fake, it's at least a technically accurate fake.
The good news is that after tomorrow, we can stop looking at rumors and start discussing actual facts.