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[SmokSmog]

 

[MrTroubleMaker]

 

[SweetTooth]

The PS6 will be AMD again. So no RT.

 

[OverHeat]

That it’s going to suck at RT compared to nvidia sure!

 

[Magic Carpet]

I still don't understand how they get all those tiny wires hooked into the chip itself. I've seen a video of a machine doing it and all I could see was what looked like tiny wispy strings of hot metal blowing around and suddenly all the wires are connected.

 

[Buggy Loop]

I still don't understand how they get all those tiny wires hooked into the chip itself. I've seen a video of a machine doing it and all I could see was what looked like tiny wispy strings of hot metal blowing around and suddenly all the wires are connected.

? The interface between the PCB and the chipset? They don’t use bonding wires on such complex devices, they take too much space and the process complexity goes exponential with how complex the chipset is.

They use BGA, ball grid arrays, soldering balls to make contacts

We see it a bit here in this 4090 reballing video (insane job to do manually)



Or you meant something else?

 

[Magic Carpet]

? The interface between the PCB and the chipset? They don’t use bonding wires on such complex devices, they take too much space and the process complexity goes exponential with how complex the chipset is.

They use BGA, ball grid arrays, soldering balls to make contacts

We see it a bit here in this 4090 reballing video (insane job to do manually)



Or you meant something else?

I'm talking about under all those balls, they got to connect those balls to the chip itself somehow. Thats what I don't understand.

 

[Xyphie]

I'm talking about under all those balls, they got to connect those balls to the chip itself somehow. Thats what I don't understand.

It's not really any different than how the substrate attaches to the PCB, just that the solder balls on the GPU die are much smaller. It's called flip chip.

 

[Magic Carpet]

It's not really any different than how the substrate attaches to the PCB, just that the solder balls on the GPU die are much smaller. It's called flip chip.

I'm thinking more like this.

Wire bonding - Wikipedia

en.wikipedia.org

 

[Xyphie]

I'm thinking more like this.

Wire bonding - Wikipedia

en.wikipedia.org

Wire bonding is for less complex chips because the connection density isn't as high.

 

[Magic Carpet]

Wire bonding is for less complex chips because the connection density isn't as high.

Thanks, I've been on wikipedia learning about all this morning thanks to the links.

 

[Hohenheim]

I am going to be pissed off if we dont get 5090 this Jan. I do not want a 5080 -_-

it looks weak compared to the 5090 by allot.

it doesnt even look more powerful than the 4090. I know it's a different design but Nvidia discontinuing the 4090 means the 5080 is about on par with the 4090 at a much cheaper price. IF i wanted a 4090 level i would have kept my card. I want the next best thing.

cmon Nvidia. 5090.. day one. lets go .

Hopefully it's only a few weeks apart from the 5080.

 

[Buggy Loop]

I'm talking about under all those balls, they got to connect those balls to the chip itself somehow. Thats what I don't understand.

Micro balls /bumps/pillars, not solder nowadays for the most part but making the interface to the substrate and bonded in epoxy or other exotic bonding techniques

Everything is balls/pillars for interfacing from die to substrate to PCB

As for creating those bumps on silicon

Did that on one hand on cellphone while baby is sleeping on me, sorry if it’s barebones hehe, but from that you can search the subjects deeper.

Edit, one of my favourite channel on the die technology, brief history of packaging

 

[iQuasarLV]

Micro balls /bumps/pillars, not solder nowadays for the most part but making the interface to the substrate and bonded in epoxy or other exotic bonding techniques

Everything is balls/pillars for interfacing from die to substrate to PCB

As for creating those bumps on silicon

Did that on one hand on cellphone while baby is sleeping on me, sorry if it’s barebones hehe, but from that you can search the subjects deeper.

Edit, one of my favourite channel on the die technology, brief history of packaging

Ah, another person of taste I see. =D

 

[Magic Carpet]

Micro balls /bumps/pillars, not solder nowadays for the most part but making the interface to the substrate and bonded in epoxy or other exotic bonding techniques

Everything is balls/pillars for interfacing from die to substrate to PCB

As for creating those bumps on silicon

Did that on one hand on cellphone while baby is sleeping on me, sorry if it’s barebones hehe, but from that you can search the subjects deeper.

Edit, one of my favourite channel on the die technology, brief history of packaging

I think I'm finally starting to wrap my brain around it. Man, I knew it was a bunch of connections but dang.

 

[Buggy Loop]

I think I'm finally starting to wrap my brain around it. Man, I knew it was a bunch of connections but dang.

Modern chipsets are insanely complex yea.

The course I did on semiconductors for electrical engineering was just the basics and everyone had a nose bleed in that course. Let alone modern chips. It’s witchcraft

Nothing human made is more complex than this

Breaks my brain even more so when we go into the scales of the silicon die itself.

Speaking of which, really cool video on lithography ASML put out 4 weeks ago

 

[YeulEmeralda]

She was 4 nanometers you sick fuck!