Technically, this is all IBM have officially said on the subject:
http://www-03.ibm.com/press/us/en/pressrelease/34683.wss
http://www-03.ibm.com/press/us/en/photo/34681.wss
Curiously enough, in the regurgitated newsbit making rounds on the internet, the quantifier "a lot" has been used in conjunction with edram. But we have no credible source for that, AFAIK. IBM's own claim is that in comparison to sram, they can put 3x the amount of memory in the form of edram. So wheres you'd have 4-8MB of on-die L2/L3 in other designs, you could in theory have 12-24MB of similar-purpose memory in IBM's. That tells us next to nothing about how much edram Nintendo could afford to put on a separate die (ala Xenos) if they decided to.
Engadget
Details were scarce about the IBM silicon Nintendo's new HD powerhouse was packing, but we did some digging to get a little more info. IBM tells us that within the Wii U there's a 45nm custom chip with "a lot" of embedded DRAM (shown above). It's a silicon on insulator design and packs the same processor technology found in Watson, the supercomputer that bested a couple of meatbags on Jeopardy awhile back. Unfortunately, IBM wouldn't give us the chip's clock speeds, but if it's good enough to smoke Ken Jennings on national TV, we imagine it'll do alright against its competition from Sony and Microsoft.