I bet magnus and its derivatives, and orion, all will be on the same single die, it can be stacked, tiles, fabric connected.
There is no way they will go back to PS360 design
Refer to AMD's Strix Halo's MCM (multi-chip module) on a single APU package. Most Granite Ridge Ryzens on the AM5 platform are MCM APUs since they include a tiny RDNA 2 IGPU on the IOD (I/O die).
AMD's Strix Halo APU has two Granite Ridge CCDs with a big GPU IOD. Depending on the target market, both CCD and IOD can change scale.
For example,
Very compact Zen6 CCD with medium-large GPU IOD can target game consoles.
Fat Zen6 CCDs with very large GPU IOD can target server LLMs.
High-density compact Zen6 CCDs with very large GPU IOD can target server LLMs.
Fat Zen6 CCDs with medium-large GPU IOD can target business desktop/DTR laptop LLMs.
Fat Zen6 CCDs with small GPU IOD can target AM5 desktop platforms. Usually paired with a discrete GPU card.
Fat Zen6 CCDs with Epyc IOD can target traditional servers. Can be paired with discrete GPU cards.
High-density compact Zen6 CCDs with Epyc IOD can target traditional servers. Can be paired with discrete GPU cards.
All AMD SKUs can run FreeBSD, Linux, and Windows.
Zen 2 already has 3 grades from fat (PC desktop/server Zen 2), compact (e.g. PC mobile Zen 2s), and very compact (e.g. PS5's Zen 2).
Zen 5 already has 4 grades from fat (Granite Ridge Zen 5 with full-width AVX-512 hardware implementation), compact (Strix Point Zen 5), very compact (Strix Point's very compact Zen 5), and high-density compact (Zen 5 Turin Epyc with full-width AVX-512 hardware implementation).
Zen 6 generation has LP CPU cores i.e. AMD's #metoo Intel Luna Lake's LP CPU cores.