captainclutch777
Member
Have used both, liquid metal and thermal paste. Thermal paste is the way better option for longevity. Performance wise I noticed a 2 degree reduction using the liquid metal but it dried up twice on me in two seperate rigs and at one point almost fried my system because of it. It’s really a baffling decision from Sony because I have no idea how they expect this to function for the entire 6-7 year lifecycle. Maybe they’ve revolutionized it somehow, but as of right now we’ll just sit and wait.
Sounds like a case of user error to me. Plenty PC users (including myself) have used it without issues for years. Application is key.
Additionally they clearly have "revolutionized it" , that being the entire topic of this thread. I'm all for armchair engineering, but let's not overreact here. Sony isn't a someone at home experimenting with thermal compounds.
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